NEO Semiconductor says its 3D X-DRAM passed proof-of-concept testing, using 3D NAND processes to target cheaper AI memory than HBM. The company has secured funding for development.
NEO Semiconductor's revolutionary 3D X-DRAM for AI processors has passed proof-of-concept validation — company secures funding to develop next-gen memory HBM alternative
Etiido Uko·Tom's Hardware··1 min read
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